Liquid Cooling Systems White Papers

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Monitoring the Computer Room's Physical Environment
sponsored by Sensaphone
WHITE PAPER: This paper addresses the greatest environmental threats to the functionality of small to medium computer rooms and presents the time and cost savings associated with the integration of a remote monitoring system.
Posted: 22 Apr 2008 | Published: 22 Apr 2008

Sensaphone

Humidification Stratiegies for Data Centers and Network Rooms
sponsored by Schneider Electric
WHITE PAPER: This paper explains the nature of humidity, its effects and its management in computer rooms and data centers.
Posted: 26 Mar 2014 | Published: 20 Nov 2008

Schneider Electric

Cooling Cost-Saving Strategies: Comfort Cooling vs. Precision Cooling
sponsored by Emerson Network Power
WHITE PAPER: Important differences exist between precision cooling and building air conditioning (comfort cooling) in controlling these environmental conditions. In this paper, we compare both cooling systems’ ability to maintain favorable environmental conditions, and their energy efficiency and annual operating costs.
Posted: 11 Oct 2010 | Published: 11 Oct 2010

Emerson Network Power

Liebert: The Right Cooling for IT Environments
sponsored by Emerson Network Power
WHITE PAPER: Many IT professionals are finding that dedicated precision cooling is the right solution to provide the ideal environment for sensitive electronics. Read this paper to learn why precision cooling is the optimal choice for keeping data centers cool in the most cost-effective way.
Posted: 13 Jul 2010 | Published: 13 Jul 2010

Emerson Network Power

HP 3PAR F-Class Storage Systems: A mid-range storage revolution for lean times
sponsored by Hewlett Packard Enterprise
WHITE PAPER: This solution brief details the benefits of HP 3PAR F-Class Storage Systems.  Some of these are 50% fewer arrays that reduce capacity, power, cooling, and floor space by up to 75%. HP 3PAR F-Class Storage Systems can also reduce storage administration time by 90%. Read this document for more.
Posted: 28 Feb 2011 | Published: 28 Feb 2011

Hewlett Packard Enterprise

Frequently Asked Questions about Virtualization and the Microsoft/AMD Solution
sponsored by AMD, Hewlett-Packard and Microsoft
WHITE PAPER: With virtualization, businesses can increase IT capacity at a lower cost, reduce energy costs and carbon footprint, and have a computing platform that can easily scale as their needs evolve. This white paper details the benefits businesses can achieve through virtualization.
Posted: 16 Aug 2010 | Published: 11 Aug 2010

All resources sponsored by AMD, Hewlett-Packard and Microsoft

The Four Trends Driving the Future of Data Center Infrastructure Design and Management
sponsored by Emerson Network Power
WHITE PAPER: Today’s data center manager must maintain or improve availability in increasingly dense computing environments while reducing costs and increasing efficiency. Discover four distinct opportunities throughout the lifecycle of the data center to achieve efficiencies, boost availability and prepare for the future.
Posted: 21 Jan 2010 | Published: 21 Jan 2010

Emerson Network Power

IBM BladeCenter vs. HP BladeSystem
sponsored by IBM
WHITE PAPER: This white paper explores the key server components that influence power consumption. Get detailed guidance on data center planning, architecture, server implementation, and management so you can ensure maximum performance and power utilization.
Posted: 09 Aug 2011 | Published: 01 May 2010

IBM

Incentive Programs for Data Center Thermal Analysis, Energy Assessments and Server Consolidation Projects
sponsored by IBM Software Group
WHITE PAPER: Find out how IBM can help you optimize power consumption and cooling capacity to improve efficiency and save you money.
Posted: 05 Dec 2007 | Published: 01 May 2007

IBM Software Group

The Different Technologies for Cooling Data Centers
sponsored by Schneider Electric
WHITE PAPER: This white paper talks about data center cooling and the advantages, disadvantages and applications of the 13 basic methods for heat removal.
Posted: 28 Feb 2014 | Published: 31 Dec 2012

Schneider Electric